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Physical Properties Test Standard Unit Value Hardness ASTM D2240 shore A 95 Hardness ASTM D2240 shore D 51 Density ASTM D792 g/cm3 1.19 Tensile strength ASTM D412 (500mm/min) MPa 50 100% modulus ASTM D412 (500mm/min) MPa 14.5 300% modulus ASTM D412 (500mm/min) MPa 26 Elongation at break ASTM D412 (500mm / min)% CDXX lacrimam Fortitudo ASTM D264 (500mm / MINE (Modum 24h) CXLV D395 (Modum B. 24. DC95 (Modum C. 24. TR10% (Modum BREGUMENTUM TR10% XXI) XXXIII TR10 GB / T7758 - MMII ℃ - Low Temperatus DECREMENTUM TRIC3 GB / T (VII) DCCLVIII - MMII ℃ - 15.7 humilis temperatus DECREMENTUM TR50 GB / T (VII) DCCLVIII - MMII ℃ -

Materia parametri

Physica proprietatibus test vexillum unitas valorem

D2240 ASTM D2240 Litus a XCV

D2240 D2240 D2240 D LI

Density ASTM D792 G / CM3 1,19

Tensile Fortis ASTM D412 (500mm / min) MPA L

C% modulus ASTM D412 (500mm / min) MPA 14.5

CCC & modulus ASTM D412 (500mm / min) MPA XXVI

Elongatio ad confractus ASTM D412 (500mm / min) CDXX%

Lacrimam vires ASTM D264 (500mm / min) N / mm CXLV

AMMINUM DIN (LIII) DXVI MM3 XXIX

Cogo Set (LXX ℃ 24H) ASTM D395 (Modum B. compressionem rate XXV%) XXI% XXI

Cogo Set (C ℃ 24h) ASTM D395 (Ratio B. Compressio Rate XXV%) XXXIII%

Minimum Temperatus DECREMENTUM TR10 GB / T7758 - MMII ℃ - XXIV

Minimum Temperatus DECREMENTUM TRIC3 GB / T (VII) DCCLVIII - MMII ℃ - 15,7

Minimum Temperatus DECREMENTUM TR50 GB / T (VII) DCCLVIII - MMII ℃ - 9,8

Material application missionibus

Working temperature: Polyformaldehyde POM -30-100 ℃, phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃ Working temperature: Polyformaldehyde POM -30-100 ℃, phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃ Working temperature: Polyformaldehyde POM -30-100 ℃, phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃ Working temperature: Polyformaldehyde POM -30-100 ℃, phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃ Working temperature: Polyformaldehyde POM -30-100 ℃, Phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃, working temperature: POM -30-100 ℃, phenolic resin PF -55-120 ℃, filled PTFE+40% copper powder -200-260 ℃, working temperature: POM -30-100 ℃, phenolic resin PF -55-120 ℃, repleti ptfe + XL% aeris pulveris - CC - CCLX ℃, working temperatus: pom - XXX - Cf ℃, phenolic resinae pf - LV% aeris pulveris - CC - ℃